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Processing of printed silver patterns on an ETFE substrate

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Processing of printed silver patterns on an ETFE substrate. / Mikkonen, Riikka; Lahokallio, Sanna; Frisk, Laura; Mäntysalo, Matti.

Proceedings - 2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018. IEEE, 2018. p. 1-7 8423860.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Mikkonen, R, Lahokallio, S, Frisk, L & Mäntysalo, M 2018, Processing of printed silver patterns on an ETFE substrate. in Proceedings - 2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018., 8423860, IEEE, pp. 1-7, IMAPS Nordic Conference on Microelectronics Packaging, Oulu, Finland, 12/06/18. https://doi.org/10.23919/NORDPAC.2018.8423860

APA

Mikkonen, R., Lahokallio, S., Frisk, L., & Mäntysalo, M. (2018). Processing of printed silver patterns on an ETFE substrate. In Proceedings - 2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018 (pp. 1-7). [8423860] IEEE. https://doi.org/10.23919/NORDPAC.2018.8423860

Vancouver

Mikkonen R, Lahokallio S, Frisk L, Mäntysalo M. Processing of printed silver patterns on an ETFE substrate. In Proceedings - 2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018. IEEE. 2018. p. 1-7. 8423860 https://doi.org/10.23919/NORDPAC.2018.8423860

Author

Mikkonen, Riikka ; Lahokallio, Sanna ; Frisk, Laura ; Mäntysalo, Matti. / Processing of printed silver patterns on an ETFE substrate. Proceedings - 2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018. IEEE, 2018. pp. 1-7

Bibtex - Download

@inproceedings{ab3f164558db456c9873a7e99aa9e631,
title = "Processing of printed silver patterns on an ETFE substrate",
abstract = "Printed electronics makes it possible to fabricate devices on thin and flexible substrates at a low cost and with simple processing. However, substrate characteristics can make patterning challenging. Here, we report our approach for processing printed silver patterns on an extremely hydrophobic ethylene-Tetrafluoroethylene (ETFE) foil substrate. The effects of selected surface modification methods on substrate characteristics and final print quality were studied, and the thermal characteristics of ETFE were determined. Conductive silver patterns were fabricated using both screen printing and inkjet printing techniques. Additionally, intense pulse light method was compared to thermal annealing as an alternative annealing method. The surface modification of ETFE was observed to affect ink wetting and print quality. It was concluded that the impact of the chosen annealing method on the final characteristics of the printed structures was significant.",
keywords = "DSC, ETFE, IPL, Printed electronics, TMA",
author = "Riikka Mikkonen and Sanna Lahokallio and Laura Frisk and Matti M{\"a}ntysalo",
note = "EXT={"}Lahokallio, Sanna{"} EXT={"}Frisk, Laura{"}",
year = "2018",
month = "7",
day = "31",
doi = "10.23919/NORDPAC.2018.8423860",
language = "English",
isbn = "9789526815053",
pages = "1--7",
booktitle = "Proceedings - 2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018",
publisher = "IEEE",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Processing of printed silver patterns on an ETFE substrate

AU - Mikkonen, Riikka

AU - Lahokallio, Sanna

AU - Frisk, Laura

AU - Mäntysalo, Matti

N1 - EXT="Lahokallio, Sanna" EXT="Frisk, Laura"

PY - 2018/7/31

Y1 - 2018/7/31

N2 - Printed electronics makes it possible to fabricate devices on thin and flexible substrates at a low cost and with simple processing. However, substrate characteristics can make patterning challenging. Here, we report our approach for processing printed silver patterns on an extremely hydrophobic ethylene-Tetrafluoroethylene (ETFE) foil substrate. The effects of selected surface modification methods on substrate characteristics and final print quality were studied, and the thermal characteristics of ETFE were determined. Conductive silver patterns were fabricated using both screen printing and inkjet printing techniques. Additionally, intense pulse light method was compared to thermal annealing as an alternative annealing method. The surface modification of ETFE was observed to affect ink wetting and print quality. It was concluded that the impact of the chosen annealing method on the final characteristics of the printed structures was significant.

AB - Printed electronics makes it possible to fabricate devices on thin and flexible substrates at a low cost and with simple processing. However, substrate characteristics can make patterning challenging. Here, we report our approach for processing printed silver patterns on an extremely hydrophobic ethylene-Tetrafluoroethylene (ETFE) foil substrate. The effects of selected surface modification methods on substrate characteristics and final print quality were studied, and the thermal characteristics of ETFE were determined. Conductive silver patterns were fabricated using both screen printing and inkjet printing techniques. Additionally, intense pulse light method was compared to thermal annealing as an alternative annealing method. The surface modification of ETFE was observed to affect ink wetting and print quality. It was concluded that the impact of the chosen annealing method on the final characteristics of the printed structures was significant.

KW - DSC

KW - ETFE

KW - IPL

KW - Printed electronics

KW - TMA

U2 - 10.23919/NORDPAC.2018.8423860

DO - 10.23919/NORDPAC.2018.8423860

M3 - Conference contribution

SN - 9789526815053

SP - 1

EP - 7

BT - Proceedings - 2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018

PB - IEEE

ER -