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Reliability Evaluation Structures for Stacked Thin Dice Packaging

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review


Original languageEnglish
Title of host publicationProceedings of Fifty-Third Electronic Components & Technology Conference, May 27-30, 2003, New Orleans, Louisiana, USA
Publication statusPublished - 2003
Publication typeA4 Article in a conference publication

Publication forum classification