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Reliability Issues of Flip Chip Joining Using No-Flow Underfills

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Details

Original languageEnglish
Title of host publication14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany
Pages303-307
Publication statusPublished - 2003
Publication typeB3 Non-refereed article in conference proceedings

Publication forum classification