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Reliability Issues of Flip Chip Joining Using No-Flow Underfills

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Standard

Reliability Issues of Flip Chip Joining Using No-Flow Underfills. / Aalto, K.; Ristolainen, E.

14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany. 2003. p. 303-307.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Harvard

Aalto, K & Ristolainen, E 2003, Reliability Issues of Flip Chip Joining Using No-Flow Underfills. in 14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany. pp. 303-307.

APA

Aalto, K., & Ristolainen, E. (2003). Reliability Issues of Flip Chip Joining Using No-Flow Underfills. In 14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany (pp. 303-307)

Vancouver

Aalto K, Ristolainen E. Reliability Issues of Flip Chip Joining Using No-Flow Underfills. In 14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany. 2003. p. 303-307

Author

Aalto, K. ; Ristolainen, E. / Reliability Issues of Flip Chip Joining Using No-Flow Underfills. 14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany. 2003. pp. 303-307

Bibtex - Download

@inproceedings{2f00766237f2474ea1a94e79914feee0,
title = "Reliability Issues of Flip Chip Joining Using No-Flow Underfills",
author = "K. Aalto and E. Ristolainen",
note = "Contribution: organisation=ele,FACT1=1",
year = "2003",
language = "English",
pages = "303--307",
booktitle = "14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Reliability Issues of Flip Chip Joining Using No-Flow Underfills

AU - Aalto, K.

AU - Ristolainen, E.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2003

Y1 - 2003

M3 - Conference contribution

SP - 303

EP - 307

BT - 14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany

ER -