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Reliability of ACA interconnections on microvia HDI PCBs in thermal cycling conditions

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Standard

Reliability of ACA interconnections on microvia HDI PCBs in thermal cycling conditions. / Frisk, L.; Lahokallio, S.; Kiilunen, J.

IMAPS Nordic Annual Conference 2016 Proceedings. ed. / J. Kutilainen. IMAPS-International Microelectronics and Packaging Society, 2016.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Frisk, L, Lahokallio, S & Kiilunen, J 2016, Reliability of ACA interconnections on microvia HDI PCBs in thermal cycling conditions. in J Kutilainen (ed.), IMAPS Nordic Annual Conference 2016 Proceedings. IMAPS-International Microelectronics and Packaging Society, IMAPS Nordic Annual Conference, Tonsberg, Norway, 5/06/16.

APA

Frisk, L., Lahokallio, S., & Kiilunen, J. (2016). Reliability of ACA interconnections on microvia HDI PCBs in thermal cycling conditions. In J. Kutilainen (Ed.), IMAPS Nordic Annual Conference 2016 Proceedings IMAPS-International Microelectronics and Packaging Society.

Vancouver

Frisk L, Lahokallio S, Kiilunen J. Reliability of ACA interconnections on microvia HDI PCBs in thermal cycling conditions. In Kutilainen J, editor, IMAPS Nordic Annual Conference 2016 Proceedings. IMAPS-International Microelectronics and Packaging Society. 2016

Author

Frisk, L. ; Lahokallio, S. ; Kiilunen, J. / Reliability of ACA interconnections on microvia HDI PCBs in thermal cycling conditions. IMAPS Nordic Annual Conference 2016 Proceedings. editor / J. Kutilainen. IMAPS-International Microelectronics and Packaging Society, 2016.

Bibtex - Download

@inproceedings{83f699986e0c4a8d8072ee0dd442cf1b,
title = "Reliability of ACA interconnections on microvia HDI PCBs in thermal cycling conditions",
abstract = "New packaging technologies require new high density substrates. In built up high density interconnect (HDI) printed circuit boards (PCB) high density is achieved by using built up microvia layers. Such HDI PCBs may be used in many applications. In flip chip technology a bare chip is attached directly to a substrate which enables very high density and requires often also HDI PCBs. Anisotropic conductive adhesives (ACA) are especially well suited interconnection materials for high density flip chip applications. In this study the reliability of flip chip ACA attachments on several different HDI PCBs was studied. The PCBs had similar core layers, but the microvia layers of the PCBs were different. Test chips were attached on these PCBs using an ACA film (ACF). The reliability of the interconnections was tested using fast thermal cycling between the temperatures of -40?C and 125?C. Several failures were seen with all PCB materials during the 2,000 cycles of testing. The differences in the reliability of the different microvia layers were found to be relatively small and the microvia layer composition did not seem to be critical for the thermal cycling reliability of the ACF interconnections.",
keywords = "Anisotropic conductive adhesive, Flip chip, High density interconnect, Printed circuit board, Reliability, Thermal cycling",
author = "L. Frisk and S. Lahokallio and J. Kiilunen",
year = "2016",
month = "6",
day = "5",
language = "English",
editor = "Kutilainen, { J.}",
booktitle = "IMAPS Nordic Annual Conference 2016 Proceedings",
publisher = "IMAPS-International Microelectronics and Packaging Society",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Reliability of ACA interconnections on microvia HDI PCBs in thermal cycling conditions

AU - Frisk, L.

AU - Lahokallio, S.

AU - Kiilunen, J.

PY - 2016/6/5

Y1 - 2016/6/5

N2 - New packaging technologies require new high density substrates. In built up high density interconnect (HDI) printed circuit boards (PCB) high density is achieved by using built up microvia layers. Such HDI PCBs may be used in many applications. In flip chip technology a bare chip is attached directly to a substrate which enables very high density and requires often also HDI PCBs. Anisotropic conductive adhesives (ACA) are especially well suited interconnection materials for high density flip chip applications. In this study the reliability of flip chip ACA attachments on several different HDI PCBs was studied. The PCBs had similar core layers, but the microvia layers of the PCBs were different. Test chips were attached on these PCBs using an ACA film (ACF). The reliability of the interconnections was tested using fast thermal cycling between the temperatures of -40?C and 125?C. Several failures were seen with all PCB materials during the 2,000 cycles of testing. The differences in the reliability of the different microvia layers were found to be relatively small and the microvia layer composition did not seem to be critical for the thermal cycling reliability of the ACF interconnections.

AB - New packaging technologies require new high density substrates. In built up high density interconnect (HDI) printed circuit boards (PCB) high density is achieved by using built up microvia layers. Such HDI PCBs may be used in many applications. In flip chip technology a bare chip is attached directly to a substrate which enables very high density and requires often also HDI PCBs. Anisotropic conductive adhesives (ACA) are especially well suited interconnection materials for high density flip chip applications. In this study the reliability of flip chip ACA attachments on several different HDI PCBs was studied. The PCBs had similar core layers, but the microvia layers of the PCBs were different. Test chips were attached on these PCBs using an ACA film (ACF). The reliability of the interconnections was tested using fast thermal cycling between the temperatures of -40?C and 125?C. Several failures were seen with all PCB materials during the 2,000 cycles of testing. The differences in the reliability of the different microvia layers were found to be relatively small and the microvia layer composition did not seem to be critical for the thermal cycling reliability of the ACF interconnections.

KW - Anisotropic conductive adhesive

KW - Flip chip

KW - High density interconnect

KW - Printed circuit board

KW - Reliability

KW - Thermal cycling

M3 - Conference contribution

BT - IMAPS Nordic Annual Conference 2016 Proceedings

A2 - Kutilainen, J.

PB - IMAPS-International Microelectronics and Packaging Society

ER -