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Reliability of adhesive joined thinned chips on flexible substrates under humid conditions

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)2058-2063
Number of pages6
JournalMicroelectronics Reliability
Volume54
Issue number9-10
DOIs
Publication statusPublished - 2014
Publication typeA1 Journal article-refereed

Publication forum classification