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Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure

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Details

Original languageEnglish
Pages (from-to)1763-1766
Number of pages4
JournalProcedia Engineering
Volume168
DOIs
Publication statusPublished - 2016
Publication typeA1 Journal article-refereed
EventEurosensors -
Duration: 1 Jan 2000 → …

Abstract

Sensor components may markedly differ from typical silicon chips. Consequently, versatile attachment methods are required for their interconnections. Anisotropic conductive adhesives (ACA) are interesting materials for attachments of sensors due to their versatility. In this study reliability of ACA attached humidity sensors was studied in hygrothermal conditions. The reliability of the interconnections was found to be excellent even under prolonged exposure showing that high reliability can be achieved with ACA materials in sensor applications.

ASJC Scopus subject areas

Keywords

  • Anisotropic conductive adhesive, Flip chip, FR4, Humidity sensor, Humidity testing, Polyimide, Reliability

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