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Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review


Original languageEnglish
Title of host publicationSMTA Pan Pacific Microelectronics Symposium, February 11-13, 2014, Hawaii, USA
Place of PublicationEdina, Minnesota
PublisherSurface Mount Technology Association
Number of pages8
ISBN (Print)978-0-9888873-3-6
Publication statusPublished - 2014
Publication typeA4 Article in a conference publication
EventPan Pacific Microelectronics Symposium -
Duration: 1 Jan 2014 → …


ConferencePan Pacific Microelectronics Symposium
Period1/01/14 → …

Publication forum classification