Tampere University of Technology

TUTCRIS Research Portal

Reliability of high density flip chip on flex interconnection

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific


Original languageEnglish
Title of host publicationIMAPS - Europe Prague 2000, June 18-20, 2000, Prague, Czech Republic
Number of pages5
Publication statusPublished - 2000
Publication typeB3 Non-refereed article in conference proceedings

Publication forum classification