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Reliability of isotropic electrically conductive adhesives under condensing humidity testing

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Reliability of isotropic electrically conductive adhesives under condensing humidity testing. / Frisk, Laura; Lahokallio, Sanna; Mostofizadeh, Milad; Kiilunen, Janne; Saarinen, Kirsi.

2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5-7 December, Singapore. Institute of Electrical and Electronics Engineers IEEE, 2012. p. 174-179 6507073 (IEEE Electronics Packaging Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Frisk, L, Lahokallio, S, Mostofizadeh, M, Kiilunen, J & Saarinen, K 2012, Reliability of isotropic electrically conductive adhesives under condensing humidity testing. in 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5-7 December, Singapore., 6507073, IEEE Electronics Packaging Technology Conference, Institute of Electrical and Electronics Engineers IEEE, pp. 174-179, IEEE Electronics Packaging Technology Conference, 1/01/00. https://doi.org/10.1109/EPTC.2012.6507073

APA

Frisk, L., Lahokallio, S., Mostofizadeh, M., Kiilunen, J., & Saarinen, K. (2012). Reliability of isotropic electrically conductive adhesives under condensing humidity testing. In 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5-7 December, Singapore (pp. 174-179). [6507073] (IEEE Electronics Packaging Technology Conference). Institute of Electrical and Electronics Engineers IEEE. https://doi.org/10.1109/EPTC.2012.6507073

Vancouver

Frisk L, Lahokallio S, Mostofizadeh M, Kiilunen J, Saarinen K. Reliability of isotropic electrically conductive adhesives under condensing humidity testing. In 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5-7 December, Singapore. Institute of Electrical and Electronics Engineers IEEE. 2012. p. 174-179. 6507073. (IEEE Electronics Packaging Technology Conference). https://doi.org/10.1109/EPTC.2012.6507073

Author

Frisk, Laura ; Lahokallio, Sanna ; Mostofizadeh, Milad ; Kiilunen, Janne ; Saarinen, Kirsi. / Reliability of isotropic electrically conductive adhesives under condensing humidity testing. 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5-7 December, Singapore. Institute of Electrical and Electronics Engineers IEEE, 2012. pp. 174-179 (IEEE Electronics Packaging Technology Conference).

Bibtex - Download

@inproceedings{d722281e669d488b87f14d8e15d0f1c3,
title = "Reliability of isotropic electrically conductive adhesives under condensing humidity testing",
author = "Laura Frisk and Sanna Lahokallio and Milad Mostofizadeh and Janne Kiilunen and Kirsi Saarinen",
note = "Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-12-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE",
year = "2012",
doi = "10.1109/EPTC.2012.6507073",
language = "English",
isbn = "978-146734551-4",
series = "IEEE Electronics Packaging Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers IEEE",
pages = "174--179",
booktitle = "2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5-7 December, Singapore",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Reliability of isotropic electrically conductive adhesives under condensing humidity testing

AU - Frisk, Laura

AU - Lahokallio, Sanna

AU - Mostofizadeh, Milad

AU - Kiilunen, Janne

AU - Saarinen, Kirsi

N1 - Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-12-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2012

Y1 - 2012

U2 - 10.1109/EPTC.2012.6507073

DO - 10.1109/EPTC.2012.6507073

M3 - Conference contribution

SN - 978-146734551-4

T3 - IEEE Electronics Packaging Technology Conference

SP - 174

EP - 179

BT - 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5-7 December, Singapore

PB - Institute of Electrical and Electronics Engineers IEEE

ER -