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Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)272-280
Number of pages9
JournalMicroelectronics Reliability
Volume54
Issue number1
DOIs
Publication statusPublished - 2014
Publication typeA1 Journal article-refereed

Publication forum classification