Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors
Research output: Contribution to journal › Article › Scientific › peer-review
Details
| Original language | English |
|---|---|
| Pages (from-to) | 272-280 |
| Number of pages | 9 |
| Journal | Microelectronics Reliability |
| Volume | 54 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2014 |
| Publication type | A1 Journal article-refereed |