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RF-Performance of a Low Cost Flip Chip Assembly

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationInterPACK'01 - The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, July 8-13, 2001, Kauai, Hawaii, USA
Pages4 s
Publication statusPublished - 2001
Publication typeA4 Article in a conference publication

Publication forum classification