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Sequential stress combinations in product level reliability testing of industrial electronics

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationThe 16th Electronics Packaging Technology Conference, EPTC 2014, 3-5 December 2014, Marina Bay Sands, Singapore
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers IEEE
Pages738-742
Number of pages5
ISBN (Print)978-1-4799-6994-4
Publication statusPublished - 2014
Publication typeA4 Article in a conference publication
EventIEEE Electronics Packaging Technology Conference -
Duration: 1 Jan 1900 → …

Conference

ConferenceIEEE Electronics Packaging Technology Conference
Period1/01/00 → …

Publication forum classification

Field of science, Statistics Finland