Sequential stress combinations in product level reliability testing of industrial electronics
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
Details
| Original language | English |
|---|---|
| Title of host publication | The 16th Electronics Packaging Technology Conference, EPTC 2014, 3-5 December 2014, Marina Bay Sands, Singapore |
| Place of Publication | Piscataway, NJ |
| Publisher | Institute of Electrical and Electronics Engineers IEEE |
| Pages | 738-742 |
| Number of pages | 5 |
| ISBN (Print) | 978-1-4799-6994-4 |
| Publication status | Published - 2014 |
| Publication type | A4 Article in a conference publication |
| Event | IEEE Electronics Packaging Technology Conference - Duration: 1 Jan 1900 → … |
Conference
| Conference | IEEE Electronics Packaging Technology Conference |
|---|---|
| Period | 1/01/00 → … |