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Shear stress modeling of ACA joints in thermal tests

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal
EditorsL.J. Ernst, G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers IEEE
Pages1-8
Number of pages8
ISBN (Electronic)978-1-4673-1513-5
ISBN (Print)978-146731512-8
DOIs
Publication statusPublished - 2012
Publication typeA4 Article in a conference publication

Publication series

NameIEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Publication forum classification