Tampere University of Technology

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Stacked 3-D MCP with Plastic Ball Vertical Interconnections

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication53rd Electronic Components & Technology Conference, May 27-30, 2003, New Orleans, Louisiana, USA
Pages1101-1105
Publication statusPublished - 2003
Publication typeA4 Article in a conference publication

Publication forum classification