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Static Bending of Flip-Chip Structures Under Humid Conditions

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)1163-1170
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume3
Issue number7
DOIs
Publication statusPublished - 2013
Publication typeA1 Journal article-refereed

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