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Strength of nanoscale copper connection under shear

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Details

Original languageEnglish
Title of host publicationTechnical Proceedings of the Third International Conference on Modeling and Simulation of Microsystems, March 27-29, 2000, US Grant Grand Heritage Hotel, San Diego, California, USA
Place of PublicationUSA
Pages67-70
Publication statusPublished - 2000
Publication typeB3 Non-refereed article in conference proceedings

Publication forum classification