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The adhesion of copper on reinforced core material using sputtered interface metallic layers

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Details

Original languageEnglish
Title of host publication2000 IEMT/IMS Symposium, April 19-21, 2000, Sonic City-Omiya, Tokyo
Pages151-154
Publication statusPublished - 2000
Publication typeB3 Non-refereed article in conference proceedings

Publication forum classification