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The Effect of Bonding Temperature and Curing Time on Peel Strength of Anisotropically Conductive Film Flex-On-Board Samples

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)455-461
JournalIEEE Transactions on Device and Materials Reliability
Volume12
Issue number2
DOIs
Publication statusPublished - 2012
Publication typeA1 Journal article-refereed