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The effect of humidity on reliability of flip chip joints on flexible LCP and PI substrates

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationProceedings of the IMAPS Nordic Annual Conference, Helsingor, Denmark, 26-28 September 2004
Pages196-201
Publication statusPublished - 2004
Publication typeA4 Article in a conference publication

Publication forum classification