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The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationInterPACK'03. International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, USA, July 6-11, 2003
Pages10 s
Publication statusPublished - 2003
Publication typeA4 Article in a conference publication

Publication forum classification