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The effect of PCB surface finish on lead-free solder joints

Research output: Contribution to journalArticleScientificpeer-review

Standard

The effect of PCB surface finish on lead-free solder joints. / Nurmi, S.; Sundelin, J.; Ristolainen, E.; Lepistö, T.

In: Soldering and Surface Mount Technology, Vol. 17, No. 1, 2005, p. 13-23.

Research output: Contribution to journalArticleScientificpeer-review

Harvard

Nurmi, S, Sundelin, J, Ristolainen, E & Lepistö, T 2005, 'The effect of PCB surface finish on lead-free solder joints', Soldering and Surface Mount Technology, vol. 17, no. 1, pp. 13-23. https://doi.org/10.1108/09540910510579203

APA

Nurmi, S., Sundelin, J., Ristolainen, E., & Lepistö, T. (2005). The effect of PCB surface finish on lead-free solder joints. Soldering and Surface Mount Technology, 17(1), 13-23. https://doi.org/10.1108/09540910510579203

Vancouver

Nurmi S, Sundelin J, Ristolainen E, Lepistö T. The effect of PCB surface finish on lead-free solder joints. Soldering and Surface Mount Technology. 2005;17(1):13-23. https://doi.org/10.1108/09540910510579203

Author

Nurmi, S. ; Sundelin, J. ; Ristolainen, E. ; Lepistö, T. / The effect of PCB surface finish on lead-free solder joints. In: Soldering and Surface Mount Technology. 2005 ; Vol. 17, No. 1. pp. 13-23.

Bibtex - Download

@article{d95b2a79e56346248dd13c632b92374f,
title = "The effect of PCB surface finish on lead-free solder joints",
author = "S. Nurmi and J. Sundelin and E. Ristolainen and T. Lepist{\"o}",
note = "ELE.MOL<br/>Contribution: organisation=ele,FACT1=0.5<br/>Contribution: organisation=mol,FACT2=0.5",
year = "2005",
doi = "10.1108/09540910510579203",
language = "English",
volume = "17",
pages = "13--23",
journal = "Soldering and Surface Mount Technology",
issn = "0954-0911",
publisher = "Emerald Group Publishing Ltd.",
number = "1",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - The effect of PCB surface finish on lead-free solder joints

AU - Nurmi, S.

AU - Sundelin, J.

AU - Ristolainen, E.

AU - Lepistö, T.

N1 - ELE.MOL<br/>Contribution: organisation=ele,FACT1=0.5<br/>Contribution: organisation=mol,FACT2=0.5

PY - 2005

Y1 - 2005

U2 - 10.1108/09540910510579203

DO - 10.1108/09540910510579203

M3 - Article

VL - 17

SP - 13

EP - 23

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

SN - 0954-0911

IS - 1

ER -