Tampere University of Technology

TUTCRIS Research Portal

The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)28-37
JournalSoldering and Surface Mount Technology
Volume18
Issue number4
Publication statusPublished - 2006
Publication typeA1 Journal article-refereed

Publication forum classification