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The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study

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The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study. / Ampatzoglou, Areti; Ampatzoglou, Apostolos; Chatzigeorgiou, Alexander; Avgeriou, Paris; Abrahamsson, Pekka; Martini, Antonio; Zdun, Uwe; Systä, Kari.

2016 IEEE 8th International Workshop on Managing Technical Debt (MTD). IEEE, 2016.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Ampatzoglou, A, Ampatzoglou, A, Chatzigeorgiou, A, Avgeriou, P, Abrahamsson, P, Martini, A, Zdun, U & Systä, K 2016, The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study. in 2016 IEEE 8th International Workshop on Managing Technical Debt (MTD). IEEE, International Workshop on Managing Technical Debt, 1/01/00. https://doi.org/10.1109/MTD.2016.8

APA

Ampatzoglou, A., Ampatzoglou, A., Chatzigeorgiou, A., Avgeriou, P., Abrahamsson, P., Martini, A., ... Systä, K. (2016). The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study. In 2016 IEEE 8th International Workshop on Managing Technical Debt (MTD) IEEE. https://doi.org/10.1109/MTD.2016.8

Vancouver

Ampatzoglou A, Ampatzoglou A, Chatzigeorgiou A, Avgeriou P, Abrahamsson P, Martini A et al. The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study. In 2016 IEEE 8th International Workshop on Managing Technical Debt (MTD). IEEE. 2016 https://doi.org/10.1109/MTD.2016.8

Author

Ampatzoglou, Areti ; Ampatzoglou, Apostolos ; Chatzigeorgiou, Alexander ; Avgeriou, Paris ; Abrahamsson, Pekka ; Martini, Antonio ; Zdun, Uwe ; Systä, Kari. / The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study. 2016 IEEE 8th International Workshop on Managing Technical Debt (MTD). IEEE, 2016.

Bibtex - Download

@inproceedings{d56889820d554b009912d0bc94d71b58,
title = "The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study",
abstract = "Technical Debt Management (TDM) has drawn the attention of software industries during the last years, including embedded systems. However, we currently lack an overview of how practitioners from this application domain perceive technical debt. To this end, we conducted a multiple case study in the embedded systems industry, to investigate: (a) the expected life-time of components that have TD, (b) the most frequently occurring types of TD in them, and (c) the significance of TD against run-time quality attributes. The case study was performed on seven embedded systems industries (telecommunications, printing, smart manufacturing, sensors, etc.) from five countries (Greece, Netherlands, Sweden, Austria, and Finland). The results of the case study suggest that: (a) maintainability is more seriously considered when the expected lifetime of components is larger than ten years, (b) the most frequent types of debt are test, architectural, and code debt, and (c) in embedded systems the run-time qualities are prioritized compared to design-time qualities that are usually associated with TD. The obtained results can be useful for both researchers and practitioners: the former can focus their research on the most industrially-relevant aspects of TD, whereas the latter can be informed about the most common types of TD and how to focus their TDM processes.",
author = "Areti Ampatzoglou and Apostolos Ampatzoglou and Alexander Chatzigeorgiou and Paris Avgeriou and Pekka Abrahamsson and Antonio Martini and Uwe Zdun and Kari Syst{\"a}",
year = "2016",
month = "10",
day = "4",
doi = "10.1109/MTD.2016.8",
language = "English",
booktitle = "2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)",
publisher = "IEEE",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study

AU - Ampatzoglou, Areti

AU - Ampatzoglou, Apostolos

AU - Chatzigeorgiou, Alexander

AU - Avgeriou, Paris

AU - Abrahamsson, Pekka

AU - Martini, Antonio

AU - Zdun, Uwe

AU - Systä, Kari

PY - 2016/10/4

Y1 - 2016/10/4

N2 - Technical Debt Management (TDM) has drawn the attention of software industries during the last years, including embedded systems. However, we currently lack an overview of how practitioners from this application domain perceive technical debt. To this end, we conducted a multiple case study in the embedded systems industry, to investigate: (a) the expected life-time of components that have TD, (b) the most frequently occurring types of TD in them, and (c) the significance of TD against run-time quality attributes. The case study was performed on seven embedded systems industries (telecommunications, printing, smart manufacturing, sensors, etc.) from five countries (Greece, Netherlands, Sweden, Austria, and Finland). The results of the case study suggest that: (a) maintainability is more seriously considered when the expected lifetime of components is larger than ten years, (b) the most frequent types of debt are test, architectural, and code debt, and (c) in embedded systems the run-time qualities are prioritized compared to design-time qualities that are usually associated with TD. The obtained results can be useful for both researchers and practitioners: the former can focus their research on the most industrially-relevant aspects of TD, whereas the latter can be informed about the most common types of TD and how to focus their TDM processes.

AB - Technical Debt Management (TDM) has drawn the attention of software industries during the last years, including embedded systems. However, we currently lack an overview of how practitioners from this application domain perceive technical debt. To this end, we conducted a multiple case study in the embedded systems industry, to investigate: (a) the expected life-time of components that have TD, (b) the most frequently occurring types of TD in them, and (c) the significance of TD against run-time quality attributes. The case study was performed on seven embedded systems industries (telecommunications, printing, smart manufacturing, sensors, etc.) from five countries (Greece, Netherlands, Sweden, Austria, and Finland). The results of the case study suggest that: (a) maintainability is more seriously considered when the expected lifetime of components is larger than ten years, (b) the most frequent types of debt are test, architectural, and code debt, and (c) in embedded systems the run-time qualities are prioritized compared to design-time qualities that are usually associated with TD. The obtained results can be useful for both researchers and practitioners: the former can focus their research on the most industrially-relevant aspects of TD, whereas the latter can be informed about the most common types of TD and how to focus their TDM processes.

U2 - 10.1109/MTD.2016.8

DO - 10.1109/MTD.2016.8

M3 - Conference contribution

BT - 2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)

PB - IEEE

ER -