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Thermal Behavior of Stacked System-in-Package

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Details

Original languageEnglish
Title of host publicationProceedings of EuroSIME 2003, Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems
EditorsL.J. Ernst
Pages71-75
Publication statusPublished - 2003
Publication typeB3 Non-refereed article in conference proceedings

Publication forum classification