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Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationEMPC 2013, European Microelectronics Packaking Conference, 9-12 September 2013, Grenoble, France
PublisherInstitute of Electrical and Electronics Engineers IEEE
Pages1-6
Number of pages6
ISBN (Print)978-2-95-274671-7
Publication statusPublished - 2013
Publication typeA4 Article in a conference publication

Publication series

NameEuropean Microelectronics and Packaging Conference

Publication forum classification