Thermal Cycling of Anisotropically Conductive Adhesive Interconnections in Demanding Sensor Applications
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
| Original language | English |
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| Title of host publication | EMPC 2013, European Microelectronics Packaking Conference, 9-12 September 2013, Grenoble, France |
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| Publisher | Institute of Electrical and Electronics Engineers IEEE |
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| Pages | 1-6 |
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| Number of pages | 6 |
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| ISBN (Print) | 978-2-95-274671-7 |
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| Publication status | Published - 2013 |
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| Publication type | A4 Article in a conference publication |
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| Name | European Microelectronics and Packaging Conference |
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