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Thermomechanical properties of overmold epoxies in MEMS packaging

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Details

Original languageEnglish
Title of host publicationProceedings of the IMAPS Nordic Annual Conference , June 8-9, 2015, Helsingør, Denmark
PublisherIMAPS Nordic
Pages175-179
Number of pages5
ISBN (Print)9781510808133
Publication statusPublished - 2015
Publication typeB3 Non-refereed article in conference proceedings
EventInternational Microelectronics and Packaging Society Nordic Annual Conference -
Duration: 1 Jan 1900 → …

Conference

ConferenceInternational Microelectronics and Packaging Society Nordic Annual Conference
Period1/01/00 → …

Publication forum classification

Field of science, Statistics Finland