Thermomechanical properties of overmold epoxies in MEMS packaging
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific
Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the IMAPS Nordic Annual Conference , June 8-9, 2015, Helsingør, Denmark |
| Publisher | IMAPS Nordic |
| Pages | 175-179 |
| Number of pages | 5 |
| ISBN (Print) | 9781510808133 |
| Publication status | Published - 2015 |
| Publication type | B3 Non-refereed article in conference proceedings |
| Event | International Microelectronics and Packaging Society Nordic Annual Conference - Duration: 1 Jan 1900 → … |
Conference
| Conference | International Microelectronics and Packaging Society Nordic Annual Conference |
|---|---|
| Period | 1/01/00 → … |