Thermomechanical properties of overmold epoxies in MEMS packaging
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific
Details
Original language | English |
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Title of host publication | Proceedings of the IMAPS Nordic Annual Conference , June 8-9, 2015, Helsingør, Denmark |
Publisher | IMAPS Nordic |
Pages | 175-179 |
Number of pages | 5 |
ISBN (Print) | 9781510808133 |
Publication status | Published - 2015 |
Publication type | B3 Non-refereed article in conference proceedings |
Event | International Microelectronics and Packaging Society Nordic Annual Conference - Duration: 1 Jan 1900 → … |
Conference
Conference | International Microelectronics and Packaging Society Nordic Annual Conference |
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Period | 1/01/00 → … |