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Titanium Nitride Microelectrodes Deposited by Ion Beam Assisted E-beam Evaporation

Research output: Other conference contributionPaper, poster or abstractScientific


Original languageEnglish
Publication statusPublished - 24 Jun 2016
EventMEA meeting 2016 -
Duration: 28 Jun 20161 Jul 2016


ConferenceMEA meeting 2016
Internet address


An alternative method for fabricating titanium nitride (TiN) microelectrodes is presented. In order to decrease the impedance and noise levels of microelectrodes, one of the most common methods is to coat the electrodes with TiN. Usually that has required the use of a sputtering device, but we have demonstrated that also an e-beam coater can be used for TiN deposition, if equipped with an ion source. Our first 30 µm microelectrodes fabricated by ion beam assisted deposition (IBAD) have impedances around 75 kΩ, which is close to the impedances reported for sputter deposited TiN microelectrodes.


  • microelectrode, Titanium nitride, e-Beam evaporation, Ion beam assisted deposition, MEA

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