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Undercut edges for robust capillary self-alignment in hybrid microassembly

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Pages1088-1091
Number of pages4
DOIs
Publication statusPublished - 2013
Publication typeA4 Article in a conference publication
Event8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, China
Duration: 7 Apr 201310 Apr 2013

Conference

Conference8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
CountryChina
CitySuzhou
Period7/04/1310/04/13

Abstract

In this paper, we report capillary self-alignment of 200 μm × 200 μm square parts on matching patterns with undercut edges. The undercut edge structure is a purely topographical feature that provides ultimate pinning for liquids of any surface tension without chemical treatment. We show contact angles close to 180° for low surface tension liquids, and capillary self-alignment using thermally curable adhesive. Sub-micron alignment accuracy after adhesive curing is verified in a scanning electron microscope (SEM).

Keywords

  • microassembly, microfabrication, self-alignment, surface tension, wetting