Undercut edges for robust capillary self-alignment in hybrid microassembly
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
Details
| Original language | English |
|---|---|
| Title of host publication | 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 |
| Pages | 1088-1091 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2013 |
| Publication type | A4 Article in a conference publication |
| Event | 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, China Duration: 7 Apr 2013 → 10 Apr 2013 |
Conference
| Conference | 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 |
|---|---|
| Country | China |
| City | Suzhou |
| Period | 7/04/13 → 10/04/13 |
Abstract
In this paper, we report capillary self-alignment of 200 μm × 200 μm square parts on matching patterns with undercut edges. The undercut edge structure is a purely topographical feature that provides ultimate pinning for liquids of any surface tension without chemical treatment. We show contact angles close to 180° for low surface tension liquids, and capillary self-alignment using thermally curable adhesive. Sub-micron alignment accuracy after adhesive curing is verified in a scanning electron microscope (SEM).
ASJC Scopus subject areas
Keywords
- microassembly, microfabrication, self-alignment, surface tension, wetting