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Use of microcutting for high throughput electrode patterning on a flexible substrate

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Details

Original languageEnglish
Article number015015
Number of pages7
JournalJournal of Micromechanics and Microengineering
Volume24
Issue number1
DOIs
Publication statusPublished - Jan 2014
Publication typeA1 Journal article-refereed

Abstract

The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal-semiconductor junctions.

Keywords

  • microcutting, self-alignment, NIL, hot embossing, FIELD-EFFECT TRANSISTORS, NANOIMPRINT LITHOGRAPHY, THIN, CIRCUITS, FILMS, STEP

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