Tampere University of Technology

TUTCRIS Research Portal

Validation of homogenized filament bundle model in AC loss computations

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Article number4705505
Pages (from-to)1-5
Number of pages5
JournalIEEE Transactions on Applied Superconductivity
Volume22
Issue number3
DOIs
Publication statusPublished - 2012
Publication typeA1 Journal article-refereed

Publication forum classification