TUTCRIS - Tampereen teknillinen yliopisto

TUTCRIS

Chip-to-package wireless power transfer and its application to mm-Wave antennas and monolithic radiometric receivers

Tutkimustuotosvertaisarvioitu

Yksityiskohdat

AlkuperäiskieliEnglanti
OtsikkoRSW 2013 - 2013 IEEE Radio and Wireless Symposium - RWW 2013
Sivut202-204
Sivumäärä3
DOI - pysyväislinkit
TilaJulkaistu - 2013
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
Tapahtuma2013 IEEE Radio and Wireless Symposium, RSW 2013 - 2013 7th IEEE Radio and Wireless Week, RWW 2013 - Austin, TX, Yhdysvallat
Kesto: 20 tammikuuta 201323 tammikuuta 2013

Conference

Conference2013 IEEE Radio and Wireless Symposium, RSW 2013 - 2013 7th IEEE Radio and Wireless Week, RWW 2013
MaaYhdysvallat
KaupunkiAustin, TX
Ajanjakso20/01/1323/01/13

Tiivistelmä

A chip-to-package wireless power transfer concept is applied to MMIC and antennas on LCP substrate is presented. Electromagnetic simulations show the feasibility of the proposed approach. As a benchmarking topology at the working frequency of 35.4 GHz, an Archimedean spiral antenna matched to a heterogeneous transformer, which couples the power received by the antenna to the chip, has been simulated. Transistor level circuit simulations are also proposed for the LNA and the detector, which together will constitute the system-on-chip (SoC) radiometer to be integrated in the LCP-SoP.