TUTCRIS - Tampereen teknillinen yliopisto

TUTCRIS

Combination of E-jet and inkjet printing for additive fabrication of multilayer high-density RDL of silicon interposer

Tutkimustuotosvertaisarvioitu

Yksityiskohdat

AlkuperäiskieliEnglanti
Sivut1217-1224
Sivumäärä8
JulkaisuIEEE Transactions on Electron Devices
Vuosikerta64
Numero3
DOI - pysyväislinkit
TilaJulkaistu - 1 maaliskuuta 2017
OKM-julkaisutyyppiA1 Alkuperäisartikkeli

Tiivistelmä

The additive nature and high resolution of electrohydrodynamic inkjet (E-jet) printing can be utilized for manufacturing micrometer scale conductive tracks such as those required in the high-density redistribution layers (RDLs) of silicon interposers used in electronics packaging for 3-D integration. Compared to the current lithographic fabrication method, this approach promises to increase the customizability of the process and reduce the amount of waste materials, thereby lowering the costs and the environmental impact of the manufacturing process. In this paper, multilayer interdigitated capacitor and meander resistor structures with 5/5 μm conductor width/spacing are used to demonstrate the feasibility of E-jet printing of high-density multilayer RDLs. A sheet resistance of 28.5 Ω/square was achieved for the first metallization layer (MET1) conductors and 313.2 7Ω/square for the MET2 conductors. The thickness of the conductors was 6.9 μm for MET1 and 5.4 μm for MET2.

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