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Effect of inter-layer pressure on dielectric breakdown characteristics of metallized polymer films for capacitor applications

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Effect of inter-layer pressure on dielectric breakdown characteristics of metallized polymer films for capacitor applications. / Rytöluoto, Ilkka; Lahti, Kari.

IEEE International Conference on Solid Dielectrics ICSD, June 30th - July 4th 2013, Bologna, Italy. Institute of Electrical and Electronics Engineers IEEE, 2013. s. 682-687 (IEEE International Conference on Solid Dielectrics).

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Harvard

Rytöluoto, I & Lahti, K 2013, Effect of inter-layer pressure on dielectric breakdown characteristics of metallized polymer films for capacitor applications. julkaisussa IEEE International Conference on Solid Dielectrics ICSD, June 30th - July 4th 2013, Bologna, Italy. IEEE International Conference on Solid Dielectrics, Institute of Electrical and Electronics Engineers IEEE, Sivut 682-687. https://doi.org/10.1109/ICSD.2013.6619787

APA

Rytöluoto, I., & Lahti, K. (2013). Effect of inter-layer pressure on dielectric breakdown characteristics of metallized polymer films for capacitor applications. teoksessa IEEE International Conference on Solid Dielectrics ICSD, June 30th - July 4th 2013, Bologna, Italy (Sivut 682-687). (IEEE International Conference on Solid Dielectrics). Institute of Electrical and Electronics Engineers IEEE. https://doi.org/10.1109/ICSD.2013.6619787

Vancouver

Rytöluoto I, Lahti K. Effect of inter-layer pressure on dielectric breakdown characteristics of metallized polymer films for capacitor applications. julkaisussa IEEE International Conference on Solid Dielectrics ICSD, June 30th - July 4th 2013, Bologna, Italy. Institute of Electrical and Electronics Engineers IEEE. 2013. s. 682-687. (IEEE International Conference on Solid Dielectrics). https://doi.org/10.1109/ICSD.2013.6619787

Author

Rytöluoto, Ilkka ; Lahti, Kari. / Effect of inter-layer pressure on dielectric breakdown characteristics of metallized polymer films for capacitor applications. IEEE International Conference on Solid Dielectrics ICSD, June 30th - July 4th 2013, Bologna, Italy. Institute of Electrical and Electronics Engineers IEEE, 2013. Sivut 682-687 (IEEE International Conference on Solid Dielectrics).

Bibtex - Lataa

@inproceedings{17c2dc064cc84df599fd0434e0d2667b,
title = "Effect of inter-layer pressure on dielectric breakdown characteristics of metallized polymer films for capacitor applications",
author = "Ilkka Ryt{\"o}luoto and Kari Lahti",
note = "Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-10-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE",
year = "2013",
doi = "10.1109/ICSD.2013.6619787",
language = "English",
isbn = "978-1-4799-0807-3",
series = "IEEE International Conference on Solid Dielectrics",
publisher = "Institute of Electrical and Electronics Engineers IEEE",
pages = "682--687",
booktitle = "IEEE International Conference on Solid Dielectrics ICSD, June 30th - July 4th 2013, Bologna, Italy",

}

RIS (suitable for import to EndNote) - Lataa

TY - GEN

T1 - Effect of inter-layer pressure on dielectric breakdown characteristics of metallized polymer films for capacitor applications

AU - Rytöluoto, Ilkka

AU - Lahti, Kari

N1 - Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-10-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2013

Y1 - 2013

U2 - 10.1109/ICSD.2013.6619787

DO - 10.1109/ICSD.2013.6619787

M3 - Conference contribution

SN - 978-1-4799-0807-3

T3 - IEEE International Conference on Solid Dielectrics

SP - 682

EP - 687

BT - IEEE International Conference on Solid Dielectrics ICSD, June 30th - July 4th 2013, Bologna, Italy

PB - Institute of Electrical and Electronics Engineers IEEE

ER -