TUTCRIS - Tampereen teknillinen yliopisto

TUTCRIS

Effect of PCB surface finish on creep properties of lead-free solder joints

Tutkimustuotosvertaisarvioitu

Standard

Effect of PCB surface finish on creep properties of lead-free solder joints. / Sundelin, J.J.; Nurmi, S.T.; Lepistö, T.K.; Ristolainen, E.O.

julkaisussa: Soldering and Surface Mount Technology, Vuosikerta 17, Nro 4, 2005, s. 3-9.

Tutkimustuotosvertaisarvioitu

Harvard

Sundelin, JJ, Nurmi, ST, Lepistö, TK & Ristolainen, EO 2005, 'Effect of PCB surface finish on creep properties of lead-free solder joints', Soldering and Surface Mount Technology, Vuosikerta. 17, Nro 4, Sivut 3-9.

APA

Sundelin, J. J., Nurmi, S. T., Lepistö, T. K., & Ristolainen, E. O. (2005). Effect of PCB surface finish on creep properties of lead-free solder joints. Soldering and Surface Mount Technology, 17(4), 3-9.

Vancouver

Sundelin JJ, Nurmi ST, Lepistö TK, Ristolainen EO. Effect of PCB surface finish on creep properties of lead-free solder joints. Soldering and Surface Mount Technology. 2005;17(4):3-9.

Author

Sundelin, J.J. ; Nurmi, S.T. ; Lepistö, T.K. ; Ristolainen, E.O. / Effect of PCB surface finish on creep properties of lead-free solder joints. Julkaisussa: Soldering and Surface Mount Technology. 2005 ; Vuosikerta 17, Nro 4. Sivut 3-9.

Bibtex - Lataa

@article{9f6864d5e0604a669a1215bbe451ee19,
title = "Effect of PCB surface finish on creep properties of lead-free solder joints",
author = "J.J. Sundelin and S.T. Nurmi and T.K. Lepist{\"o} and E.O. Ristolainen",
note = "ISSN 0954-0911<br/>Contribution: organisation=mol,FACT1=0.5<br/>Contribution: organisation=ele,FACT2=0.5",
year = "2005",
language = "English",
volume = "17",
pages = "3--9",
journal = "Soldering and Surface Mount Technology",
issn = "0954-0911",
publisher = "Emerald Group Publishing Ltd.",
number = "4",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Effect of PCB surface finish on creep properties of lead-free solder joints

AU - Sundelin, J.J.

AU - Nurmi, S.T.

AU - Lepistö, T.K.

AU - Ristolainen, E.O.

N1 - ISSN 0954-0911<br/>Contribution: organisation=mol,FACT1=0.5<br/>Contribution: organisation=ele,FACT2=0.5

PY - 2005

Y1 - 2005

M3 - Article

VL - 17

SP - 3

EP - 9

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

SN - 0954-0911

IS - 4

ER -