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TUTCRIS

Effect of substrate material and thickness on reliability of ACA bonded flip chip joints

Tutkimustuotosvertaisarvioitu

Standard

Effect of substrate material and thickness on reliability of ACA bonded flip chip joints. / Frisk, L.; Cumini, A.

julkaisussa: Soldering and Surface Mount Technology, Vuosikerta 21, Nro 3, 2009, s. 16-23.

Tutkimustuotosvertaisarvioitu

Harvard

Frisk, L & Cumini, A 2009, 'Effect of substrate material and thickness on reliability of ACA bonded flip chip joints', Soldering and Surface Mount Technology, Vuosikerta. 21, Nro 3, Sivut 16-23. https://doi.org/10.1108/09540910910970376

APA

Frisk, L., & Cumini, A. (2009). Effect of substrate material and thickness on reliability of ACA bonded flip chip joints. Soldering and Surface Mount Technology, 21(3), 16-23. https://doi.org/10.1108/09540910910970376

Vancouver

Author

Frisk, L. ; Cumini, A. / Effect of substrate material and thickness on reliability of ACA bonded flip chip joints. Julkaisussa: Soldering and Surface Mount Technology. 2009 ; Vuosikerta 21, Nro 3. Sivut 16-23.

Bibtex - Lataa

@article{05372cddc4474be5a3394c2d40abf04c,
title = "Effect of substrate material and thickness on reliability of ACA bonded flip chip joints",
author = "L. Frisk and A. Cumini",
note = "Contribution: organisation=ele,FACT1=1<br/>Publisher name: Emerald Group Publishing Ltd.",
year = "2009",
doi = "10.1108/09540910910970376",
language = "English",
volume = "21",
pages = "16--23",
journal = "Soldering and Surface Mount Technology",
issn = "0954-0911",
publisher = "Emerald Group Publishing Ltd.",
number = "3",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Effect of substrate material and thickness on reliability of ACA bonded flip chip joints

AU - Frisk, L.

AU - Cumini, A.

N1 - Contribution: organisation=ele,FACT1=1<br/>Publisher name: Emerald Group Publishing Ltd.

PY - 2009

Y1 - 2009

U2 - 10.1108/09540910910970376

DO - 10.1108/09540910910970376

M3 - Article

VL - 21

SP - 16

EP - 23

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

SN - 0954-0911

IS - 3

ER -