Evaluation of Aerosol, Superfine Inkjet, and Photolithography Printing Techniques for Metallization of Application Specific Printed Electronic Circuits
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|Julkaisu||IEEE Transactions on Electron Devices|
|DOI - pysyväislinkit|
|Tila||Julkaistu - 1 maaliskuuta 2016|
Application specific printed electronic circuits (ASPECs) are the corresponding term with application-specified ICs for printed electronics. The same as any new technology, printed electronics is suffering from some restrictions in design and process technology aspects. An important stage in the ASPEC design is the final wiring of the organic thin-film transistor arrays or gate arrays to customize it to implement any specific target application that fits in their structure. In this paper, we evaluate two additive manufacturing technologies: aerosol jet using Optomec M3D and electrohydrodynamic printer using superfine inkjet. Both techniques are based on direct-writing of the pattern corresponding to any individual circuit being fabricated (digital printing) enabled by the mask-free noncontact deposition of materials. Finally, these structures will be compared with the corresponding photolithography mask technology. Some parameterized test vehicles, with different instantiations for the variation of line widths and separations, have been designed to be wired using the target technologies. These test vehicles have been fabricated at the Centre for Process Innovation by a five masks lithography and subtractive patterning technology. Results show that both direct printing technologies are feasible for the fabrication of the gate-array customization, thus allowing individual personalization of every circuit what can produce added value functionalities at low cost such as the equivalent effect of having an ROM memory which final contents could be customized at home by using low-cost digital printing technologies. Further interactions between transistor bulk and wiring technologies can improve the obtained performance in order to end up in an industrialized process.