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Geometry Analysis in Screen-Printed Stretchable Interconnects

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Geometry Analysis in Screen-Printed Stretchable Interconnects. / Mosallaei, Mahmoud; Jokinen, Jarno; Honkanen, Mari; Iso-Ketola, Pekka; Vippola, Minnamari; Vanhala, Jukka; Kanerva, Mikko; Mantysalo, Matti.

julkaisussa: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vuosikerta 8, Nro 8, 08.2018, s. 1344-1352.

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@article{edbfd1c151d54222a5aeb16f1fcddfec,
title = "Geometry Analysis in Screen-Printed Stretchable Interconnects",
abstract = "Deformability of interconnects and conductors as the skeleton of soft electronic devices plays an important role in the stretchability of the whole system. To make the interconnects stretchable, either employing deformable materials or tailoring the design are the primary approaches. It is also possible to combine the two strategies. In advanced stretchable electronic circuits, there is a frequently need for the interconnects to transform from a narrow to a wide geometry. Therefore, this paper assesses three different geometries that accommodate a narrow-to-wide transition along the interconnects. First, the geometry is modeled using Finite Element (FE) analysis. Second, in order to verify the accuracy of the FE model, screen-printed interconnects are fabricated accordingly by using silver flake ink on a deformable substrate. The geometrical modification shows a considerable improvement in the stretchability of the whole system. Additionally, the effect of encapsulation with thermoplastic polyurethane (TPU) on the performance of stretchable interconnects is investigated.",
keywords = "Conductivity, finite element analysis, Geometry, Integrated circuit interconnections, Plastics, printed electronics, screen-printing, Strain, Stress, stretchable interconnects., Substrates",
author = "Mahmoud Mosallaei and Jarno Jokinen and Mari Honkanen and Pekka Iso-Ketola and Minnamari Vippola and Jukka Vanhala and Mikko Kanerva and Matti Mantysalo",
year = "2018",
month = "8",
doi = "10.1109/TCPMT.2018.2854635",
language = "English",
volume = "8",
pages = "1344--1352",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3950",
publisher = "Institute of Electrical and Electronics Engineers",
number = "8",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Geometry Analysis in Screen-Printed Stretchable Interconnects

AU - Mosallaei, Mahmoud

AU - Jokinen, Jarno

AU - Honkanen, Mari

AU - Iso-Ketola, Pekka

AU - Vippola, Minnamari

AU - Vanhala, Jukka

AU - Kanerva, Mikko

AU - Mantysalo, Matti

PY - 2018/8

Y1 - 2018/8

N2 - Deformability of interconnects and conductors as the skeleton of soft electronic devices plays an important role in the stretchability of the whole system. To make the interconnects stretchable, either employing deformable materials or tailoring the design are the primary approaches. It is also possible to combine the two strategies. In advanced stretchable electronic circuits, there is a frequently need for the interconnects to transform from a narrow to a wide geometry. Therefore, this paper assesses three different geometries that accommodate a narrow-to-wide transition along the interconnects. First, the geometry is modeled using Finite Element (FE) analysis. Second, in order to verify the accuracy of the FE model, screen-printed interconnects are fabricated accordingly by using silver flake ink on a deformable substrate. The geometrical modification shows a considerable improvement in the stretchability of the whole system. Additionally, the effect of encapsulation with thermoplastic polyurethane (TPU) on the performance of stretchable interconnects is investigated.

AB - Deformability of interconnects and conductors as the skeleton of soft electronic devices plays an important role in the stretchability of the whole system. To make the interconnects stretchable, either employing deformable materials or tailoring the design are the primary approaches. It is also possible to combine the two strategies. In advanced stretchable electronic circuits, there is a frequently need for the interconnects to transform from a narrow to a wide geometry. Therefore, this paper assesses three different geometries that accommodate a narrow-to-wide transition along the interconnects. First, the geometry is modeled using Finite Element (FE) analysis. Second, in order to verify the accuracy of the FE model, screen-printed interconnects are fabricated accordingly by using silver flake ink on a deformable substrate. The geometrical modification shows a considerable improvement in the stretchability of the whole system. Additionally, the effect of encapsulation with thermoplastic polyurethane (TPU) on the performance of stretchable interconnects is investigated.

KW - Conductivity

KW - finite element analysis

KW - Geometry

KW - Integrated circuit interconnections

KW - Plastics

KW - printed electronics

KW - screen-printing

KW - Strain

KW - Stress

KW - stretchable interconnects.

KW - Substrates

U2 - 10.1109/TCPMT.2018.2854635

DO - 10.1109/TCPMT.2018.2854635

M3 - Article

VL - 8

SP - 1344

EP - 1352

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

SN - 2156-3950

IS - 8

ER -