TUTCRIS - Tampereen teknillinen yliopisto

TUTCRIS

High speed, high strength microwelding of Si/glass using ps-laser pulses

Tutkimustuotosvertaisarvioitu

Yksityiskohdat

AlkuperäiskieliEnglanti
Sivut3427-3439
Sivumäärä13
JulkaisuOptics Express
Vuosikerta23
Numero3
DOI - pysyväislinkit
TilaJulkaistu - 9 helmikuuta 2015
OKM-julkaisutyyppiA1 Alkuperäisartikkeli

Tiivistelmä

A novel microwelding procedure to join Si-to-glass using pslaser pulses with high repetition rates is presented. The procedure provides weld joint with mechanical strength as high as 85 MPa and 45 MPa in sample pairs of Si/aluminosilicate (Si/SW-Y) and Si/borosilicate (Si/Borofloat 33), respectively, which are higher than anodic bonding, at high spatial resolution (< 20 μm) and very high throughput without pre- and post-heating. Laser-matter interaction analysis indicates that excellent weld joint of Si/glass is obtained by avoiding violent evaporation of Si substrate using ps-laser pulses. Laser welded Si/glass samples can be singulated along the weld lines by standard blade dicer without defects, demonstrating welding by ps-laser pulses is applicable to wafer-level packaging.

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