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High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates

Tutkimustuotosvertaisarvioitu

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High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates. / Lahokallio, Sanna; Kiilunen, Janne; Frisk, Laura.

julkaisussa: Microelectronics Reliability, Vuosikerta 54, Nro 9-10, 2014, s. 2017-2022.

Tutkimustuotosvertaisarvioitu

Harvard

Lahokallio, S, Kiilunen, J & Frisk, L 2014, 'High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates', Microelectronics Reliability, Vuosikerta. 54, Nro 9-10, Sivut 2017-2022. https://doi.org/10.1016/j.microrel.2014.07.095

APA

Vancouver

Author

Lahokallio, Sanna ; Kiilunen, Janne ; Frisk, Laura. / High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates. Julkaisussa: Microelectronics Reliability. 2014 ; Vuosikerta 54, Nro 9-10. Sivut 2017-2022.

Bibtex - Lataa

@article{f27e7316845d46bcaec05176b6bf715c,
title = "High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates",
author = "Sanna Lahokallio and Janne Kiilunen and Laura Frisk",
note = "Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2014-11-30<br/>Publisher name: Pergamon Press",
year = "2014",
doi = "10.1016/j.microrel.2014.07.095",
language = "English",
volume = "54",
pages = "2017--2022",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",
number = "9-10",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates

AU - Lahokallio, Sanna

AU - Kiilunen, Janne

AU - Frisk, Laura

N1 - Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2014-11-30<br/>Publisher name: Pergamon Press

PY - 2014

Y1 - 2014

U2 - 10.1016/j.microrel.2014.07.095

DO - 10.1016/j.microrel.2014.07.095

M3 - Article

VL - 54

SP - 2017

EP - 2022

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

IS - 9-10

ER -