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HTS dipole insert developments

Tutkimustuotosvertaisarvioitu

Standard

HTS dipole insert developments. / Rey, J.-M.; Devaux, M.; Bertinelli, F.; Chaud, X.; Debray, F.; Durante, M.; Favre, G.; Fazilleau, P.; Lecrevisse, T.; Mayri, C.; Pes, C.; Pottier, F.; Sorbi, M.; Stenvall, A.; Tixador, P.; Tudela, J.-M.; Tardy, T.; Volpini, G.

julkaisussa: IEEE Transactions on Applied Superconductivity, Vuosikerta 23, Nro 3, 2013, s. 1-4.

Tutkimustuotosvertaisarvioitu

Harvard

Rey, J-M, Devaux, M, Bertinelli, F, Chaud, X, Debray, F, Durante, M, Favre, G, Fazilleau, P, Lecrevisse, T, Mayri, C, Pes, C, Pottier, F, Sorbi, M, Stenvall, A, Tixador, P, Tudela, J-M, Tardy, T & Volpini, G 2013, 'HTS dipole insert developments', IEEE Transactions on Applied Superconductivity, Vuosikerta. 23, Nro 3, Sivut 1-4. https://doi.org/10.1109/TASC.2013.2237931

APA

Rey, J-M., Devaux, M., Bertinelli, F., Chaud, X., Debray, F., Durante, M., ... Volpini, G. (2013). HTS dipole insert developments. IEEE Transactions on Applied Superconductivity, 23(3), 1-4. https://doi.org/10.1109/TASC.2013.2237931

Vancouver

Rey J-M, Devaux M, Bertinelli F, Chaud X, Debray F, Durante M et al. HTS dipole insert developments. IEEE Transactions on Applied Superconductivity. 2013;23(3):1-4. https://doi.org/10.1109/TASC.2013.2237931

Author

Rey, J.-M. ; Devaux, M. ; Bertinelli, F. ; Chaud, X. ; Debray, F. ; Durante, M. ; Favre, G. ; Fazilleau, P. ; Lecrevisse, T. ; Mayri, C. ; Pes, C. ; Pottier, F. ; Sorbi, M. ; Stenvall, A. ; Tixador, P. ; Tudela, J.-M. ; Tardy, T. ; Volpini, G. / HTS dipole insert developments. Julkaisussa: IEEE Transactions on Applied Superconductivity. 2013 ; Vuosikerta 23, Nro 3. Sivut 1-4.

Bibtex - Lataa

@article{de2147627bd74b15bb5785b9b6404fe6,
title = "HTS dipole insert developments",
author = "J.-M. Rey and M. Devaux and F. Bertinelli and X. Chaud and F. Debray and M. Durante and G. Favre and P. Fazilleau and T. Lecrevisse and C. Mayri and C. Pes and F. Pottier and M. Sorbi and A. Stenvall and P. Tixador and J.-M. Tudela and T. Tardy and G. Volpini",
note = "Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-04-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE",
year = "2013",
doi = "10.1109/TASC.2013.2237931",
language = "English",
volume = "23",
pages = "1--4",
journal = "IEEE Transactions on Applied Superconductivity",
issn = "1051-8223",
publisher = "Institute of Electrical and Electronics Engineers",
number = "3",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - HTS dipole insert developments

AU - Rey, J.-M.

AU - Devaux, M.

AU - Bertinelli, F.

AU - Chaud, X.

AU - Debray, F.

AU - Durante, M.

AU - Favre, G.

AU - Fazilleau, P.

AU - Lecrevisse, T.

AU - Mayri, C.

AU - Pes, C.

AU - Pottier, F.

AU - Sorbi, M.

AU - Stenvall, A.

AU - Tixador, P.

AU - Tudela, J.-M.

AU - Tardy, T.

AU - Volpini, G.

N1 - Contribution: organisation=dee,FACT1=1<br/>Portfolio EDEND: 2013-04-29<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2013

Y1 - 2013

U2 - 10.1109/TASC.2013.2237931

DO - 10.1109/TASC.2013.2237931

M3 - Article

VL - 23

SP - 1

EP - 4

JO - IEEE Transactions on Applied Superconductivity

JF - IEEE Transactions on Applied Superconductivity

SN - 1051-8223

IS - 3

ER -