TUTCRIS - Tampereen teknillinen yliopisto

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Identification and compensation of error sources in the microbond test utilising a reliable high-throughput device

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Yksityiskohdat

AlkuperäiskieliEnglanti
Artikkeli105988
JulkaisuComposites Part A: Applied Science and Manufacturing
Vuosikerta137
Varhainen verkossa julkaisun päivämääräkesäkuuta 2020
DOI - pysyväislinkit
TilaE-pub ahead of print - kesäkuuta 2020
OKM-julkaisutyyppiA1 Alkuperäisartikkeli

Tiivistelmä

This paper addresses the issue of high scatter in microbond test results. Implementation of the test is discussed and the reliability of a state-of-the-art test system is analysed through characterisation of the critical components of the device. In total 50 filaments and around 30 droplets from each filament are measured. The results verify that much of the commonly observed scattering originates from real variation between the filaments and heterogeneous interfacial properties, while the error from the experimentation is comparably small. A stress based analytical model was noted to agree well with the experimental results.

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