Improvements in the electromechanical properties of stretchable interconnects by locally tuning the stiffness

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Improvements in the electromechanical properties of stretchable interconnects by locally tuning the stiffness. / Mosallaei, Milad; Di Vito, Donato; Khorramdel, Behnam; Mäntysalo, Matti.

julkaisussa: Flexible and Printed Electronics, Vuosikerta 5, Nro 1, 015004, 2020.

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Bibtex - Lataa

@article{91671ce9a9b3471ba73d82773ea12785,

title = "Improvements in the electromechanical properties of stretchable interconnects by locally tuning the stiffness",

abstract = "Recent advances in materials science and structural design have changed electronic applications from being bulky and rigid objects to small and soft products that have emerged for a wide range of applications, especially human-related products for which mechanical adoption is the key requirement. A typical stretchable application consists of small-sized, rigid IC-chips and passive components interconnected by conductive tracks on soft substrates. The early failure of such devices initiates from the rigid-soft interface due to the accumulation of stress. Therefore, special attention is needed to reduce the strain concentration at the interface. In this paper, stretchable interconnects were fabricated using a screen-printing method and surface mounted devices (SMDs) were bonded using an isotropic conductive adhesive. By partially removing material from the substrate in areas a little way from the rigid components, the stiffness is locally reduced, and this leads to an increase in the local stiffness around the SMDs and hence shields the soft-rigid interface against the stress. Materials can be removed by two different patterns. A finite element analysis and experimental data show 11{\%}-19{\%} improvements in single pull-up tests for the modified samples. This approach makes the electromechanical behaviour independent of encapsulation properties.",

keywords = "electromechanical properties, finite element (FE) analysis, printed electronics, screen-printing, strain concentration, stress distribution, stretchable electronics",

author = "Milad Mosallaei and {Di Vito}, Donato and Behnam Khorramdel and Matti M{\"a}ntysalo",

year = "2020",

doi = "10.1088/2058-8585/ab68ae",

language = "English",

volume = "5",

journal = "Flexible and Printed Electronics",

issn = "2058-8585",

publisher = "IOP Publishing",

number = "1",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Improvements in the electromechanical properties of stretchable interconnects by locally tuning the stiffness

AU - Mosallaei, Milad

AU - Di Vito, Donato

AU - Khorramdel, Behnam

AU - Mäntysalo, Matti

PY - 2020

Y1 - 2020

N2 - Recent advances in materials science and structural design have changed electronic applications from being bulky and rigid objects to small and soft products that have emerged for a wide range of applications, especially human-related products for which mechanical adoption is the key requirement. A typical stretchable application consists of small-sized, rigid IC-chips and passive components interconnected by conductive tracks on soft substrates. The early failure of such devices initiates from the rigid-soft interface due to the accumulation of stress. Therefore, special attention is needed to reduce the strain concentration at the interface. In this paper, stretchable interconnects were fabricated using a screen-printing method and surface mounted devices (SMDs) were bonded using an isotropic conductive adhesive. By partially removing material from the substrate in areas a little way from the rigid components, the stiffness is locally reduced, and this leads to an increase in the local stiffness around the SMDs and hence shields the soft-rigid interface against the stress. Materials can be removed by two different patterns. A finite element analysis and experimental data show 11%-19% improvements in single pull-up tests for the modified samples. This approach makes the electromechanical behaviour independent of encapsulation properties.

AB - Recent advances in materials science and structural design have changed electronic applications from being bulky and rigid objects to small and soft products that have emerged for a wide range of applications, especially human-related products for which mechanical adoption is the key requirement. A typical stretchable application consists of small-sized, rigid IC-chips and passive components interconnected by conductive tracks on soft substrates. The early failure of such devices initiates from the rigid-soft interface due to the accumulation of stress. Therefore, special attention is needed to reduce the strain concentration at the interface. In this paper, stretchable interconnects were fabricated using a screen-printing method and surface mounted devices (SMDs) were bonded using an isotropic conductive adhesive. By partially removing material from the substrate in areas a little way from the rigid components, the stiffness is locally reduced, and this leads to an increase in the local stiffness around the SMDs and hence shields the soft-rigid interface against the stress. Materials can be removed by two different patterns. A finite element analysis and experimental data show 11%-19% improvements in single pull-up tests for the modified samples. This approach makes the electromechanical behaviour independent of encapsulation properties.

KW - electromechanical properties

KW - finite element (FE) analysis

KW - printed electronics

KW - screen-printing

KW - strain concentration

KW - stress distribution

KW - stretchable electronics

U2 - 10.1088/2058-8585/ab68ae

DO - 10.1088/2058-8585/ab68ae

M3 - Article

VL - 5

JO - Flexible and Printed Electronics

JF - Flexible and Printed Electronics

SN - 2058-8585

IS - 1

M1 - 015004

ER -

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