TUTCRIS - Tampereen teknillinen yliopisto

TUTCRIS

Laser sintering of copper nanoparticles on top of silicon substrates

Tutkimustuotosvertaisarvioitu

Yksityiskohdat

AlkuperäiskieliEnglanti
Artikkeli035203
Sivumäärä5
JulkaisuNanotechnology
Vuosikerta27
Numero3
DOI - pysyväislinkit
TilaJulkaistu - 9 joulukuuta 2015
OKM-julkaisutyyppiA1 Alkuperäisartikkeli

Tiivistelmä

This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.

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