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TUTCRIS

Multi-Objective Optimization of Fin Array Heat Sinks

Tutkimustuotosvertaisarvioitu

Yksityiskohdat

AlkuperäiskieliEnglanti
OtsikkoTherminic 2016
Alaotsikko22nd international workshop Thermal investigations of ICs and Systems
KustantajaIEEE
Sivumäärä4
ISBN (elektroninen)978-1-5090-5451-0
ISBN (painettu)978-1-5090-5450-3
DOI - pysyväislinkit
TilaJulkaistu - 21 marraskuuta 2016
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
TapahtumaInternational Workshop on Thermal Investigations of ICs and Systems -
Kesto: 1 tammikuuta 2000 → …

Conference

ConferenceInternational Workshop on Thermal Investigations of ICs and Systems
Ajanjakso1/01/00 → …

Tiivistelmä

A method is presented to determine the temperature field of an electronics cooling heat sink. The method is based on calculation of heat conduction in a solid numerically with the finite volume method and on solving fluid convection from analytical equations. The model is suitable for forced and natural convection heat sinks, and it uses solutions of a parallel plate channel for the friction factor and the convection Nusselt number. The validity of the method is verified by comparing its results to measured data and to CFD calculations. After verification, two practical multi-objective optimization examples are given. The first one, an industrial application, is a forced convection heat sink composed of nine heat generating components at the base plate. Then, natural convection optimization is performed on a reference array with two components. In both cases, mass is minimized, the other criterion being the maximum temperature for forced convection case, and the heat sink outer volume for natural convection case.

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