TUTCRIS - Tampereen teknillinen yliopisto

TUTCRIS

Multi-physics modeling and simulation of a slotted patch antenna for wireless strain sensing

Tutkimustuotosvertaisarvioitu

Yksityiskohdat

AlkuperäiskieliEnglanti
OtsikkoStructural Health Monitoring 2013: A Roadmap to Intelligent Structures - Proceedings of the 9th International Workshop on Structural Health Monitoring, IWSHM 2013
KustantajaDEStech Publications
Sivut1857-1864
Sivumäärä8
Vuosikerta2
ISBN (elektroninen)9781605951157
TilaJulkaistu - 2013
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
Tapahtuma9th International Workshop on Structural Health Monitoring: A Roadmap to Intelligent Structures, IWSHM 2013 - Stanford, Yhdysvallat
Kesto: 10 syyskuuta 201312 syyskuuta 2013

Conference

Conference9th International Workshop on Structural Health Monitoring: A Roadmap to Intelligent Structures, IWSHM 2013
MaaYhdysvallat
KaupunkiStanford
Ajanjakso10/09/1312/09/13

Tiivistelmä

This research studies multi-physics simulation of a slotted patch antenna sensor. In our previous work, a folded patch antenna was designed for passive wireless strain and crack sensing. When experiencing deformation, the antenna shape changes, causing shift in electromagnetic resonance frequency of the antenna. The wireless interrogation system utilizes the principle of electromagnetic backscattering and adopts off-the-shelf 900MHz radiofrequency identification (RFID) technology. In this research, a slotted patch antenna sensor is designed, while maintaining antenna resonance frequency to be around 900MHz. The slotted antenna detours surface current using slotted patterns, so that the electrical length is kept similar as previous folded patch antenna sensor yet sensor footprint is reduced. To accurately describe both mechanical and electromagnetic behaviors of the antenna sensor, a multi-physics coupled simulation approach is pursued. A multiphysics finite element model uses the same geometry and meshing for both mechanical and electromagnetic simulations. Because electromagnetism has little influence on the mechanical behavior of the sensor, displacement field and electrical field can be solved separately using segregated steps. Known as sequential coupling, the solution method involves two or more analyses, each solving for a different physical field. The mechanics-electromagnetics coupled simulation is implemented using a commercial software package, COMSOL. Strain sensing performance predicted by the multi-physics simulation is presented.