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Performance of a Polymer-Based Sensor Package at Extreme Temperature

Tutkimustuotosvertaisarvioitu

Standard

Performance of a Polymer-Based Sensor Package at Extreme Temperature. / Lahokallio, Sanna; Hoikkanen, Maija ; Marttila, Tuomas ; Vuorinen, Jyrki ; Kiilunen, Janne; Frisk, Laura .

julkaisussa: Journal of Electronic Materials, Vuosikerta 45, Nro 2, 2016, s. 1184-1200.

Tutkimustuotosvertaisarvioitu

Harvard

Lahokallio, S, Hoikkanen, M, Marttila, T, Vuorinen, J, Kiilunen, J & Frisk, L 2016, 'Performance of a Polymer-Based Sensor Package at Extreme Temperature', Journal of Electronic Materials, Vuosikerta. 45, Nro 2, Sivut 1184-1200. https://doi.org/10.1007/s11664-015-4198-2

APA

Lahokallio, S., Hoikkanen, M., Marttila, T., Vuorinen, J., Kiilunen, J., & Frisk, L. (2016). Performance of a Polymer-Based Sensor Package at Extreme Temperature. Journal of Electronic Materials, 45(2), 1184-1200. https://doi.org/10.1007/s11664-015-4198-2

Vancouver

Lahokallio S, Hoikkanen M, Marttila T, Vuorinen J, Kiilunen J, Frisk L. Performance of a Polymer-Based Sensor Package at Extreme Temperature. Journal of Electronic Materials. 2016;45(2):1184-1200. https://doi.org/10.1007/s11664-015-4198-2

Author

Lahokallio, Sanna ; Hoikkanen, Maija ; Marttila, Tuomas ; Vuorinen, Jyrki ; Kiilunen, Janne ; Frisk, Laura . / Performance of a Polymer-Based Sensor Package at Extreme Temperature. Julkaisussa: Journal of Electronic Materials. 2016 ; Vuosikerta 45, Nro 2. Sivut 1184-1200.

Bibtex - Lataa

@article{c9a323b0c2aa4599a82e8e0b42c09b18,
title = "Performance of a Polymer-Based Sensor Package at Extreme Temperature",
abstract = "There is an increasing need for inexpensive packaging structures for demanding industrial electronics applications. This paper studies the usability of a polymer-based sensor package at very high temperatures. Resistance-based temperature sensors were attached with polymer-based electrically conductive adhesives (ECAs) onto flexible polyimide (PI) printed circuit boards (PCB). The materials used in the structure were not specifically designed for high temperature use. However, they were all commercial materials, easily available and typically reliable under normal use conditions of consumer electronics. The samples were aged at 240°C and electrically monitored during the test. Electrically, the sensor samples were observed to fail after 100 h of aging. However, material characterisation revealed that the materials started to degrade much earlier. The adhesive layer in the PI PCB and the ECA materials started to degrade after just 30 h of aging at 240°C, and mechanically the materials were observed to become brittle, making them prone to cracking and delamination. The results showed that such a polymer package is usable at 240°C for relatively short exposure times, but under longer exposure times the mechanical reliability of the package deteriorates and this needs to be taken into account.",
author = "Sanna Lahokallio and Maija Hoikkanen and Tuomas Marttila and Jyrki Vuorinen and Janne Kiilunen and Laura Frisk",
note = "ORG=dee,0.8 ORG=mol,0.2",
year = "2016",
doi = "10.1007/s11664-015-4198-2",
language = "English",
volume = "45",
pages = "1184--1200",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Institute of Electrical and Electronics Engineers",
number = "2",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Performance of a Polymer-Based Sensor Package at Extreme Temperature

AU - Lahokallio, Sanna

AU - Hoikkanen, Maija

AU - Marttila, Tuomas

AU - Vuorinen, Jyrki

AU - Kiilunen, Janne

AU - Frisk, Laura

N1 - ORG=dee,0.8 ORG=mol,0.2

PY - 2016

Y1 - 2016

N2 - There is an increasing need for inexpensive packaging structures for demanding industrial electronics applications. This paper studies the usability of a polymer-based sensor package at very high temperatures. Resistance-based temperature sensors were attached with polymer-based electrically conductive adhesives (ECAs) onto flexible polyimide (PI) printed circuit boards (PCB). The materials used in the structure were not specifically designed for high temperature use. However, they were all commercial materials, easily available and typically reliable under normal use conditions of consumer electronics. The samples were aged at 240°C and electrically monitored during the test. Electrically, the sensor samples were observed to fail after 100 h of aging. However, material characterisation revealed that the materials started to degrade much earlier. The adhesive layer in the PI PCB and the ECA materials started to degrade after just 30 h of aging at 240°C, and mechanically the materials were observed to become brittle, making them prone to cracking and delamination. The results showed that such a polymer package is usable at 240°C for relatively short exposure times, but under longer exposure times the mechanical reliability of the package deteriorates and this needs to be taken into account.

AB - There is an increasing need for inexpensive packaging structures for demanding industrial electronics applications. This paper studies the usability of a polymer-based sensor package at very high temperatures. Resistance-based temperature sensors were attached with polymer-based electrically conductive adhesives (ECAs) onto flexible polyimide (PI) printed circuit boards (PCB). The materials used in the structure were not specifically designed for high temperature use. However, they were all commercial materials, easily available and typically reliable under normal use conditions of consumer electronics. The samples were aged at 240°C and electrically monitored during the test. Electrically, the sensor samples were observed to fail after 100 h of aging. However, material characterisation revealed that the materials started to degrade much earlier. The adhesive layer in the PI PCB and the ECA materials started to degrade after just 30 h of aging at 240°C, and mechanically the materials were observed to become brittle, making them prone to cracking and delamination. The results showed that such a polymer package is usable at 240°C for relatively short exposure times, but under longer exposure times the mechanical reliability of the package deteriorates and this needs to be taken into account.

U2 - 10.1007/s11664-015-4198-2

DO - 10.1007/s11664-015-4198-2

M3 - Article

VL - 45

SP - 1184

EP - 1200

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 2

ER -