TUTCRIS - Tampereen teknillinen yliopisto

TUTCRIS

Processing of printed silver patterns on an ETFE substrate

Tutkimustuotosvertaisarvioitu

Yksityiskohdat

AlkuperäiskieliEnglanti
OtsikkoProceedings - 2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018
KustantajaIEEE
Sivut1-7
Sivumäärä7
ISBN (painettu)9789526815053
DOI - pysyväislinkit
TilaJulkaistu - 31 heinäkuuta 2018
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
TapahtumaIMAPS Nordic Conference on Microelectronics Packaging - Oulu, Suomi
Kesto: 12 kesäkuuta 201814 kesäkuuta 2018

Conference

ConferenceIMAPS Nordic Conference on Microelectronics Packaging
MaaSuomi
KaupunkiOulu
Ajanjakso12/06/1814/06/18

Tiivistelmä

Printed electronics makes it possible to fabricate devices on thin and flexible substrates at a low cost and with simple processing. However, substrate characteristics can make patterning challenging. Here, we report our approach for processing printed silver patterns on an extremely hydrophobic ethylene-Tetrafluoroethylene (ETFE) foil substrate. The effects of selected surface modification methods on substrate characteristics and final print quality were studied, and the thermal characteristics of ETFE were determined. Conductive silver patterns were fabricated using both screen printing and inkjet printing techniques. Additionally, intense pulse light method was compared to thermal annealing as an alternative annealing method. The surface modification of ETFE was observed to affect ink wetting and print quality. It was concluded that the impact of the chosen annealing method on the final characteristics of the printed structures was significant.