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Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure

Tutkimustuotosvertaisarvioitu

Standard

Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure. / Frisk, Laura; Lahokallio, Sanna; Mostofizadeh, Milad; Parviainen, Anniina; Kiilunen, Janne.

julkaisussa: Procedia Engineering, Vuosikerta 168, 2016, s. 1763-1766.

Tutkimustuotosvertaisarvioitu

Harvard

Frisk, L, Lahokallio, S, Mostofizadeh, M, Parviainen, A & Kiilunen, J 2016, 'Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure', Procedia Engineering, Vuosikerta. 168, Sivut 1763-1766. https://doi.org/10.1016/j.proeng.2016.11.509

APA

Frisk, L., Lahokallio, S., Mostofizadeh, M., Parviainen, A., & Kiilunen, J. (2016). Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure. Procedia Engineering, 168, 1763-1766. https://doi.org/10.1016/j.proeng.2016.11.509

Vancouver

Frisk L, Lahokallio S, Mostofizadeh M, Parviainen A, Kiilunen J. Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure. Procedia Engineering. 2016;168:1763-1766. https://doi.org/10.1016/j.proeng.2016.11.509

Author

Frisk, Laura ; Lahokallio, Sanna ; Mostofizadeh, Milad ; Parviainen, Anniina ; Kiilunen, Janne. / Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure. Julkaisussa: Procedia Engineering. 2016 ; Vuosikerta 168. Sivut 1763-1766.

Bibtex - Lataa

@article{c92f6818178c4108aae70d823db970b6,
title = "Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure",
abstract = "Sensor components may markedly differ from typical silicon chips. Consequently, versatile attachment methods are required for their interconnections. Anisotropic conductive adhesives (ACA) are interesting materials for attachments of sensors due to their versatility. In this study reliability of ACA attached humidity sensors was studied in hygrothermal conditions. The reliability of the interconnections was found to be excellent even under prolonged exposure showing that high reliability can be achieved with ACA materials in sensor applications.",
keywords = "Anisotropic conductive adhesive, Flip chip, FR4, Humidity sensor, Humidity testing, Polyimide, Reliability",
author = "Laura Frisk and Sanna Lahokallio and Milad Mostofizadeh and Anniina Parviainen and Janne Kiilunen",
year = "2016",
doi = "10.1016/j.proeng.2016.11.509",
language = "English",
volume = "168",
pages = "1763--1766",
journal = "Procedia Engineering",
issn = "1877-7058",
publisher = "Elsevier",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure

AU - Frisk, Laura

AU - Lahokallio, Sanna

AU - Mostofizadeh, Milad

AU - Parviainen, Anniina

AU - Kiilunen, Janne

PY - 2016

Y1 - 2016

N2 - Sensor components may markedly differ from typical silicon chips. Consequently, versatile attachment methods are required for their interconnections. Anisotropic conductive adhesives (ACA) are interesting materials for attachments of sensors due to their versatility. In this study reliability of ACA attached humidity sensors was studied in hygrothermal conditions. The reliability of the interconnections was found to be excellent even under prolonged exposure showing that high reliability can be achieved with ACA materials in sensor applications.

AB - Sensor components may markedly differ from typical silicon chips. Consequently, versatile attachment methods are required for their interconnections. Anisotropic conductive adhesives (ACA) are interesting materials for attachments of sensors due to their versatility. In this study reliability of ACA attached humidity sensors was studied in hygrothermal conditions. The reliability of the interconnections was found to be excellent even under prolonged exposure showing that high reliability can be achieved with ACA materials in sensor applications.

KW - Anisotropic conductive adhesive

KW - Flip chip

KW - FR4

KW - Humidity sensor

KW - Humidity testing

KW - Polyimide

KW - Reliability

U2 - 10.1016/j.proeng.2016.11.509

DO - 10.1016/j.proeng.2016.11.509

M3 - Article

VL - 168

SP - 1763

EP - 1766

JO - Procedia Engineering

JF - Procedia Engineering

SN - 1877-7058

ER -