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Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Tutkimustuotosvertaisarvioitu

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Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors. / Putaala, Jussi; Hannu, Jari; Kunnari, Esa; Mäntysalo, Matti; Nousiainen, Olli; Jantunen, Heli.

julkaisussa: Microelectronics Reliability, Vuosikerta 54, Nro 1, 2014, s. 272-280.

Tutkimustuotosvertaisarvioitu

Harvard

Putaala, J, Hannu, J, Kunnari, E, Mäntysalo, M, Nousiainen, O & Jantunen, H 2014, 'Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors', Microelectronics Reliability, Vuosikerta. 54, Nro 1, Sivut 272-280. https://doi.org/10.1016/j.microrel.2013.08.021

APA

Putaala, J., Hannu, J., Kunnari, E., Mäntysalo, M., Nousiainen, O., & Jantunen, H. (2014). Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors. Microelectronics Reliability, 54(1), 272-280. https://doi.org/10.1016/j.microrel.2013.08.021

Vancouver

Author

Putaala, Jussi ; Hannu, Jari ; Kunnari, Esa ; Mäntysalo, Matti ; Nousiainen, Olli ; Jantunen, Heli. / Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors. Julkaisussa: Microelectronics Reliability. 2014 ; Vuosikerta 54, Nro 1. Sivut 272-280.

Bibtex - Lataa

@article{8a2c05a9f250464ebee111db6aca7b4b,
title = "Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors",
author = "Jussi Putaala and Jari Hannu and Esa Kunnari and Matti M{\"a}ntysalo and Olli Nousiainen and Heli Jantunen",
note = "Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-02-15<br/>Publisher name: Pergamon",
year = "2014",
doi = "10.1016/j.microrel.2013.08.021",
language = "English",
volume = "54",
pages = "272--280",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",
number = "1",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

AU - Putaala, Jussi

AU - Hannu, Jari

AU - Kunnari, Esa

AU - Mäntysalo, Matti

AU - Nousiainen, Olli

AU - Jantunen, Heli

N1 - Contribution: organisation=elt,FACT1=1<br/>Portfolio EDEND: 2014-02-15<br/>Publisher name: Pergamon

PY - 2014

Y1 - 2014

U2 - 10.1016/j.microrel.2013.08.021

DO - 10.1016/j.microrel.2013.08.021

M3 - Article

VL - 54

SP - 272

EP - 280

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

IS - 1

ER -